TIEVA Receives the Ingram Micro GCIS 2023 Solution Partner of the Year Award -TIEVA

TIEVA Commercial Director Steve Norman was delighted to announce today that the business had received the Ingram Micro 2023 GCIS 30 Award in the Solution Partner of the Year award category for the Europe, Middle East and Africa region.

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The Ingram Micro team chose their annual conference, Global Cloud & Innovation Summit, in Las Vegas, Nevada to present him with this accolade.

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TIEVA was noted to have displayed extraordinary levels of innovation, advocacy, performance, and sales success in 2022. The Solution Partner of the Year category recognises channel partners who teamed with Ingram Micro to achieve outstanding results for their customers through the delivery of high impact solutions and services.

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Speaking from the USA where Steve was attending the event, Steve said:

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